平行缝焊盖板镀层结构的热分析  

Thermal Analysis of Plating Structure on Parallel Seam Sealing Process

作　　者：蒋涵 徐中国 蒋玉齐 JIANG Han;XU Zhongguo;JIANG Yuqi(Wuxi Zhongwei High-Tech Electronics Co.,Ltd.,Wuxi 214072,China;China Key System&Integrated Circuit Co.,Ltd.,Wuxi 214072,China)

机构地区：[1]无锡中微高科电子有限公司,江苏无锡214072 [2]中科芯集成电路有限公司,江苏无锡214072

出　　处：《电子与封装》2022年第2期25-30,共6页Electronics & Packaging

摘　　要：平行缝焊是陶瓷封装中应用最为广泛的高可靠性气密性封装方式之一。由于焊接过程中,盖板表面镀层会发生熔化、破坏等过程,可伐基底会被暴露在环境中,导致盐雾腐蚀失效。利用Abaqus有限元分析软件,选择2种代表性的可伐盖板镀层结构,分析不同加载温度条件下可伐盖板及其表面镀层的温度分布。仿真结果表明,当可伐盖板采用Ni/Au的镀层结构时,控制焊接温度范围为1200~1400℃,有希望保证平行缝焊耐盐雾腐蚀可靠性,并给出其耐盐雾腐蚀机理。Parallel seam sealing process is one of the most reliability hermetic sealing technology extensivly used in ceramic package.The plating of lids will be melted during the welding process and the kovar lid will be exposed to the environment,which leads to the failure of salt-spray corrosion.Two kinds of plating structure are chosen and Abaqus software is used to analyze the distribution of temperature on kovar lid and its plating.The results show that,Ni/Au plating structure can ensure the reliability of parallel seam sealing on salt-spray corrosion during the temperature range of 1200-1400℃,which gives hope to the reliability of the salt spray corrosion resistance of the parallel welds,and the mechanism of salt-spray corrosion resistance is given.

关 键 词：平行缝焊 陶瓷封装 仿真 

分 类 号：TN305.94[电子电信—物理电子学]