3D集成晶圆键合装备现状及研究进展  

Current Situation and Research Progress of 3D Integration Wafer Bonding Equipment

作　　者：王成君 胡北辰 杨晓东 武春晖 WANG Chengjun;HU Beichen;YANG Xiaodong;WU Chunhui(School of Mechanical Engineering,Southeast University,Nanjing 211189,China;The 2nd Research Institute of CETC,Taiyuan 030024,China)

机构地区：[1]东南大学机械工程学院,江苏南京211189 [2]中国电子科技集团公司第二研究所,山西太原030024

出　　处：《电子工艺技术》2022年第2期63-67,共5页Electronics Process Technology

基　　金：科工局基础科研项目。

摘　　要：硅基异构集成和三维集成可满足电子系统小型化高密度集成、多功能高性能集成、小体积低成本集成的需求,有望成为下一代集成电路的使能技术,是集成电路领域当前和今后新的研究热点。硅基三维集成微系统可集成化合物半导体、CMOS、MEMS等芯片,充分发挥不同材料、器件和结构的优势,可实现传统组件电路的芯片化、不同节点逻辑集成电路芯片的集成化,从而提升信号处理等电子产品的性价比。梳理了晶圆键合装备的工艺过程、主要厂商及市场需求、我国晶圆键合设备研发现状,并展望了晶圆键合设备的技术发展趋势。Silicon based heterogeneous integration and three-dimensional integration can meet the needs of electronic system miniaturization,high-density integration,multi-function and high-performance integration,small volume and low-cost integration.It is expected to become the enabling technology of the next generation of integrated circuits,and is a new research hotspot in the field of integrated circuits at present and in the future.Silicon based three-dimensional integrated microsystems can integrate compound semiconductors,CMOS,MEMS and other chips,give full play to the advantages of different materials,devices and structures,and realize the chipization of traditional component circuits and the integration of different node logic integrated circuit chips,so as to improve the cost performance of electronic products such as signal processing.The process,main manufacturers and market demand of wafer bonding equipment,the research and development status of wafer bonding equipment in China are summarized,and the technical development trend of wafer bonding equipment is forecasted.

关 键 词：晶圆键合 异构集成 3D IC 共晶键合 直接键合 混合键合 

分 类 号：TN40[电子电信—微电子学与固体电子学]