塑封SIP集成模块封装可靠性分析  

The Analysis of Encapsulation Reliability for Plastic SIP Integrated Module

作　　者：刘文喆 陈道远 黄炜[1] LIU Wen-zhe;CHEN Dao-yuan;HUANG Wei(Sichuan Institute of Solid-State Circuits,China Electronics Technology Group Corp.,Chongqing 400060)

机构地区：[1]中国电子科技集团公司第二十四研究所,重庆400060

出　　处：《环境技术》2022年第1期61-64,共4页Environmental Technology

摘　　要：塑封器件具有体积小、成本低的优点,逐步替代气密性封装器件,广泛地应用于我国军用产品中。军用塑封SIP(System In Package)产品集成度高、结构复杂、可靠性要求高等特点,对塑封工艺带来了挑战,目前国内工业级塑封产品不能完全满足军用可靠性要求,工业级塑封产品常在严酷的环境应力试验下表现出失效。本文针对工业级塑封SIP器件在可靠性试验过程中出现的失效现象进行分析研究,通过超声检测、芯片切面分析等手段,结合产品应力试验结果,分析导致塑封产品失效的关键原因,并针对失效机理提出优化改进方案。Hermetic devices are gradually replaced by plastic devices which are special in smaller volume and lower price,and are widely used in the military products.At present,domestic industrial plastic devices can’t completely satisfy the requirements of military reliability.Due to the features of military plastic SIP(System In Package)devices,such as high integration,complex structure and high reliability,it comes great challenge to plastic encapsulation,in harsh environment test,failures often occurred in industrial plastic device.This paper aims at the failure phenomenon in the process of reliability screening for industrial plastic devices tested by means of X-ray observation and chip section analysis,finds out the key reason of failure,and gives proposes improvements for failure mechanism.

关 键 词：塑封器件 系统级封装 塑封分层 多应力分析 

分 类 号：TN453[电子电信—微电子学与固体电子学]