国产LTCC微流道集成T/R组件的设计与实现  被引量:8

Design and Implementation of Microfluidic Channel Integrated T/R Module Based on Domestic LTCC Material

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作  者:徐洋[1] 余雷[1] 张剑 陈春梅 岳帅旗[1] XU Yang;YU Lei;ZHANG Jian;CHEN Chunmei;YUE Shuaiqi(The 29th Research Institute of CETC,Chengdu 610036,China)

机构地区:[1]中国电子科技集团公司第二十九研究所,四川成都610036

出  处:《电子工艺技术》2022年第3期131-134,共4页Electronics Process Technology

摘  要:为快速推进低温共烧陶瓷(LTCC)材料的国产化进程,推动自研LTCC材料早日投入应用,以某型国产LTCC材料为基础设计了一款单通道T/R组件,组件内部埋置集成微流道用于功放芯片快速散热。在组件及微流道设计仿真、基板制造加工和膜层化镀改性方面进行了研究,对组件进行了装配和测试。结果显示,采用自研LTCC材料制作的单通道T/R组件工艺指标合格,装配适应性良好,微流道散热高效,主要电性能指标满足要求。该型国产LTCC材料实用性良好,具有明确的工程应用前景。In order to rapidly promote the localization progress of LTCC materials and put into use early,a single channel T/R module is designed based on a certain type of domestic LTCC materials with inner burying microfluidic channel integrated to dissipate heat of power amplifier chip rapidly.The design and simulation for module and microchannel,substrate processing,film plating optimization by ENEPIG is studied,the T/R module is assembled and tested.The results show that the technological properties of the single channel T/R module made of self-developed LTCC material are qualified,the assembling adaptability is good,the microchannel heat dissipation is efficient,and the major electrical properties can meet requirements.This domestic LTCC material has good practicability and specific prospect of engineering application.

关 键 词:低温共烧陶瓷 国产化 微流道 T/R组件 

分 类 号:TN60[电子电信—电路与系统]

 

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