多芯片组件导电胶接触电阻增大案例分析  

Case Analysis of Increased Contact Resistance of Conductive Adhesives for Multi-Chip Module

作　　者：张建 王道畅 金家富[1] 董玉 李静 ZHANG Jian;WANG Daochang;JIN Jiafu;DONG Yu;LI Jing(No.38 Research Institute of China Electronics Technology Group Corporation,Hefei 230088,China)

机构地区：[1]中国电子科技集团公司第三十八研究所,合肥230088

出　　处：《电子与封装》2022年第6期39-41,共3页Electronics & Packaging

基　　金：国家磁约束核聚变能发展研究专项子课题金刚石微波窗多功能复合金属化及低温封接技术研究(2019YFE 03100100)。

摘　　要：导电胶因工艺温度低和易于返修等特点,常用在多芯片组件中粘接芯片。在某多芯片组件筛选实验过程中存在导电胶接触电阻增大的现象,经过分析和试验验证发现,因芯片背金存在划伤缺陷及污染物等,使得Ni、Au、Ag等金属与水、氧气构成电化学腐蚀反应条件,在电流及温度的促进下形成阻隔层,阻隔层部分阻挡导电胶中银粒子接触的导电通路,从而导致界面接触电阻增大。The conductive adhesives are widely used to bond chips in multi-chip module because of low-temperature process and easy repair.The contact resistance of conductive adhesives increases during screening test for a multi-chip module.Experiment and analysis prove that Ni,Au,Ag and other metals with water and oxygen constitute electrochemical corrosion reaction conditions due to scratch and pollutant on the back gold.Barrier layer is produced quickly under the promotion of current and temperature,which obstructs the conduction of silver grain in conductive adhesives partially.Thereby,the contact resistance of interface increases.

关 键 词：导电胶 接触电阻 芯片粘接 背金 

分 类 号：TN406[电子电信—微电子学与固体电子学]