馕饼烘焙过程传热的数值模拟  

Numerical Simulation of Heat Transfer in Baking Process of Naan

作　　者：孟详欣 徐雪萌[1] 王志山[1] MENG Xiangxin;XU Xuemeng;WANG Zhishan(College of Mechanical and Electrical Engineering,Henan University of Technology,450001 Zhengzhou,China)

机构地区：[1]河南工业大学机电工程学院,郑州450001

出　　处：《粮食加工》2023年第3期16-22,共7页Grain Processing

基　　金：河南省重点研发专项(221111112000);传统特色面制食品加工关键技术与应用示范。

摘　　要：为提高中国传统面制食品的烘焙质量,对馕饼在烘焙过程中的传热进行了研究。实验测定了馕饼在烘焙过程中的温度和热物性参数变化,建立了馕饼烘焙过程传热的数学模型,并确定了馕饼比热和热导率与温度的函数关系。为验证传热模型的可靠性,使用Fluent软件模拟了馕饼的烘焙过程,馕饼表面和内部温度的模拟值与实际值的平均偏差为2.9%和3.1%,均方根误差为5.62和3.65,结果较为吻合。建立的传热模型为中国传统面制食品烘焙过程的传热研究提供了参考。Aiming at improving the baking quality of traditional Chinese flour products,the heat transfer of Naan in baking progress was studied.The changes of temperature and thermophysical properties during baking were measured,the mathematical model of heat transfer in baking progress was established,and the functional relationship of specific heat,thermal conductivity and temperature were determined.The baking process of Naan was simulated using Fluent software,which verified the reliability of the heat transfer model.The average deviation between the simulated value and the actual value of surface and internal temperature of Naan were 2.9%and 3.1%,and the root mean square errors were 5.62 and 3.65,respectively,which were in good agreement.The established heat transfer model provides a reference for the study of heat transfer in the baking process of traditional Chinese flour food.

关 键 词：馕饼 烘焙 热物性 数值模拟 中国传统面制食品 

分 类 号：TS203[轻工技术与工程—食品科学]