Si-SiC混合功率模块的低感及低热阻封装研究  

Study on Low Inductance and Low Thermal Resistance Packaging of Si-SiC Hybrid Power Module

作　　者：周云艳 鲍婕 胡娟 周斌 ZHOU Yunyan;BAO Jie;HU Juan;ZHOU Bin(College of Mechanical and Electrical Engineering,Huangshan University,Huangshan 245041,China;Huangshan Googe Co.,Ltd.,Huangshan 245061,China)

机构地区：[1]黄山学院机电工程学院,安徽黄山245041 [2]黄山谷捷股份有限公司,安徽黄山245061

出　　处：《湖北民族大学学报（自然科学版）》2023年第2期218-223,共6页Journal of Hubei Minzu University:Natural Science Edition

基　　金：安徽省自然科学研究重大项目(2022AH040270);安徽省高校优秀青年人才支持计划项目(gxyq2022087)。

摘　　要：功率集成模块相比于传统的离散系统,具有体积小、功率大、集成度高、寄生参数小以及频率特性好等优点,广泛用于工业传动、家用及车用空调、辅助逆变器等场合。论文以包含有整流、制动、逆变多单元结构组成的功率集成模块为例,分析Si-SiC混合模块相比于全硅模块的性能优势,提出在低损耗的基础上进一步减小封装寄生电感和封装结构热阻的优化方案,提升功率集成混合模块的封装性能。通过对母线连接端子的位置和功率芯片的衬板图形进行优化,可将混合模块逆变电路各相之间的封装寄生电感差异降低5.2%。进一步应用局部双层衬板结构以及高导热石墨烯复合材料等,当热流密度达到100 W/cm^(2)以上时,模块最高温度降幅可达10℃。论文对Si-SiC混合功率模块的低感及低热阻封装进行研究,为充分发挥SiC材料的优势提供了有益的参考。Compared with the traditional discrete system,the power integrated module has the advantages of small size,large power,high integration,small parasitic parameters and good frequency characteristics.It is widely used in industrial transmission,household and vehicle air conditioning,auxiliary inverter and other occasions.Taking a rectifier-brake-inverter multi-unit power integrated module as an example,this paper analyzes the performance advantages of Si-SiC hybrid module compared with all-Silicon module and proposes the optimization schemes of further reducing the parasitic inductance and thermal resistance of the packaging structure so as to increase power integrated hybrid module encapsulation performance on the basis of the low loss.By optimizing the location of the bus connection terminal and the substrate graphics of the power chips,it is found that the phase-to-phase parasitic inductance difference of the hybrid module inverter circuit can be reduced by 5.2%.When the local double-layer substrate structure and high thermal conductivity graphene composites are further applied,the maximum temperature drop of the hybrid module can be up to 10℃.This paper studies the low inductance and low thermal resistance packaging of Si-SiC hybrid power module,which provides a beneficial reference for giving full play to the advantages of SiC material.

关 键 词：混合功率模块 SIC 封装 寄生电感 热阻 

分 类 号：TM464[电气工程—电器]