全自动金球引线键合机的原理和故障分析  

Principle and Fault Analysis of Automatic Gold Ball Lead Welding Machine

作　　者：张士伟[1] 张辉[1] 韩建 ZHANG Shiwei;ZHANG Hui;HAN Jian(The 13^(th) Research Institute of CETC,Shijiazhuang 050051,China)

机构地区：[1]中国电子科技集团公司第十三研究所,河北石家庄050051

出　　处：《电子工业专用设备》2023年第3期31-36,共6页Equipment for Electronic Products Manufacturing

摘　　要：介绍了引线键合工艺的类型和特点。以全自动金球引线键合机为例,介绍了其结构组成和工艺原理,分析了影响其键合工艺稳定性的因素,并总结了金球引线键合机的常见故障以及解决方法。This paper introduces the types and characteristics of wire bonding process.Taking full-automatic gold ball lead bonding machine as an example,its structure and process principle are introduced firstly.Then the factors affecting the stability of the bonding process are analyzed in detail.Finally,the common faults and solutions of the golden ball lead bonding machine are summarized.

关 键 词：键合工艺 封装技术 超声波 焊接头系统 

分 类 号：TN305.96[电子电信—物理电子学]