球栅阵列(BGA)器件底填胶空洞测试方法及评估要求  

Test method and evaluation requirements for underfill voids of ball grid array(BGA)device

作　　者：张晟 张晨晖 金星 刘志丹 Zhang Sheng;Zhang Chenhui;Jin Xing;Liu Zhidan(Xi´an Research Institute of Navigation Technology,Xi´an 710068,Shaanxi,China)

机构地区：[1]西安导航技术研究所,陕西西安710068

出　　处：《中国胶粘剂》2023年第6期38-46,共9页China Adhesives

摘　　要：基于星载产品对导热绝缘胶可靠性应用,开展了球栅阵列(BGA)器件底填胶空洞测试方法及空洞率评估的准则研究。采用菊花链网络结构试验件,通过导热绝缘胶填充工艺验证,明确了空洞的来源过程,及各过程的主要影响因素。阐述了空洞对端机模块的影响机理及后果,根据空洞位置建立了3种空洞类型。采用工业射线计算机层析成像检测(CT)断层扫描成像系统及像素面积统计法,实现了大尺寸金属封装BGA器件底填胶空洞率的计算。研究结果表明:环境试验对空洞率有一定程度的增大影响,但该增大对菊花链试验件电性能基本没有影响;验证了菊花链试验件具有经受热循环、正弦振动、随机振动及热真空环境应力的能力,导热绝缘胶填充空洞率可以满足菊花链器件试验要求;明确了BGA器件导热绝缘胶填充空洞率的可靠性评估准则及判据示例,为填充工艺优化改进提供了指导依据。Based on the reliability application of satellite-borne products for thermal insulation adhesive,the study of test method and evaluation for underfill voids of ball grid array(BGA)device was carried out.Using the daisy-chain network structure test piece,the source process of the voids and main influencing factors of each process were identified through the verification of thermal insulation adhesive filling process.The impact mechanism and consequences of voids on the end machine module were elaborated,and three types of voids were established based on voids position.The calculation of underfill voids rate of large-sized metal packaged BGA device was achieved using an industrial ray computed tomography(CT)imaging system and pixel area statistical method.The research results showed that environmental test had a certain degree of increasing effect on voids rate,but this increase had little effect on the electrical performance of the daisy-chain test piece.It was verified that the daisychain test piece had the ability to withstand thermal cycle,sinusoidal vibration,random vibration and thermal vacuum environmental stress,and the void filling rate of thermal insulation adhesive could meet the test requirements of daisy-chain device.The reliability evaluation criteria and examples of the criterion for void filling rate of BGA device with thermal insulation adhesive were clarified,which provided a guide for the optimization and improvement of the filling process.

关 键 词：导热绝缘胶 BGA器件 菊花链 空洞率 工业CT 环境试验 评估准则 

分 类 号：TN605[电子电信—电路与系统]