加速剂对铝基覆铜板通孔电镀铜的影响  

Effect of accelerator on copper electroplating of though hole on aluminum-based copper clad laminate

作　　者：曾祥健 袁振杰 谭杰 黄俪欣 郑沛峰 杨晶 潘湛昌[1] 胡光辉[1] 何念 曾庆明 ZENG Xiangjian;YUAN Zhenjie;TAN Jie;HUANG Lixin;ZHENG Peifeng;YANG Jing;PAN Zhanchang;HU Guanghui;HE Nian;ZENG Qingming(School of Chemical Engineering and Light Industry,Guangdong University of Technology,Guangzhou 510006,China;Guangdong Lear Chemicals Co.,Ltd.,Guangzhou 511475,China)

机构地区：[1]广东工业大学轻工化工学院,广东广州510006 [2]广东利尔化学有限公司,广东广州511475

出　　处：《电镀与涂饰》2023年第13期68-74,共7页Electroplating & Finishing

基　　金：应用于PCB的化学镀镍钯金项目(GDTP2021A00572)。

摘　　要：在由70 g/L硫酸铜、200 g/L浓硫酸、60 mg/L盐酸、200 mg/L聚乙二醇(PEG6000)和1 mg/L健那绿B(JGB)组成的基础镀液中分别添加聚二硫二丙烷磺酸钠(SPS)、3-巯基-1-丙磺酸钠(MPS)和N,N-二甲基二硫代甲酰胺丙烷磺酸钠(DPS)作为加速剂。通过计时电位曲线测试和热冲击试验,研究了不同加速剂对通孔电镀铜的影响。结果表明,镀液中添加2.5 mg/L SPS或9 mg/L DPS作为加速剂时,镀液的深镀能力显著提高,所得Cu镀层的抗热冲击性能合格。Different organic compounds i.e.bis-(sodium sulfopropyl)-disulfide(SPS),sodium 3-mercapto-1-propanesulfonate(MPS),and sodium N,N-dimethyldithiocarbamylpropylsulfonate(DPS)were added respectively as an accelerator to a copper electrodeposition electrolyte containing CuSO_(4)·5H_(2)O 70 g/L,concentrated sulfuric acid 200 g/L,concentrated hydrochloric acid 60 mg/L,polyethylene glycol(PEG6000)200 mg/L,and Janus Green B(JGB)1 mg/L.The effects of different accelerators on copper electroplating of through hole were studied by chronopotentiometry and thermal shock test.The throwing power of the electrolyte could be improved greatly when being added with 2.5 mg/L SPS or 9 mg/L DPS as an accelerator,and the Cu coating obtained therefrom had qualified thermal shock resistance.

关 键 词：铝基覆铜板 通孔 电镀铜 计时电位法 加速剂 深镀能力 抗热冲击性能 

分 类 号：TQ153.14[化学工程—电化学工业]