基于气密封装的BGA基板关键工艺技术研究  

Key Process Technology Research on BGA Substrates Based on Hermetic Packaging

作　　者：常青松[1] 徐达[1] 袁彪[1] 魏少伟 CHANG Qingsong;XU Da;YUAN Biao;WEI Shaowei(The 13th Research Institute,CETC,Shijiazhuang 050051)

机构地区：[1]中国电子科技集团公司第十三研究所,石家庄050051

出　　处：《现代制造技术与装备》2023年第7期127-129,共3页Modern Manufacturing Technology and Equipment

摘　　要：球栅阵列(Ball GridArray,BGA)封装技术是一种先进的高密度封装技术,是实现多基板三维组装的关键工艺。在气密封装的多基板三维组装过程中,BGA基板在组装过程中的形变、焊点的焊接强度及空洞率、多基板间低间距等控制不良,都会影响多基板三维组装的可靠性,而封装体内助焊剂可能会污染或腐蚀封装体内元件的金属层。通过对气密封装中BGA基板三维组装过程中形变、焊接强度、清洗等关键工艺技术的研究和分析,提出气密封装中BGA基板工艺组装质量的解决措施和工艺实现途径。BGA(Ball Grid Array)technology is an advanced high-density packaging technology,which is a key process to achieve three-dimensional assembly of multiple substrates.In the process of multi-substrate 3D assembly in hermetic packaging,poor control of BGA substrate deformation,solder strength and void rate of solder joints,and low spacing between multiple substrates can affect the reliability of multi-substrate 3D assembly,while flux in the package may contaminate or corrode the metal layer of components in the package.In this paper,through the research and analysis of key process technologies such as deformation,solder strength,and cleaning during the three-dimensional assembly of BGA substrates in hermetic packaging,we propose solutions and process realization ways for the quality of BGA substrate process assembly in hermetic packaging.

关 键 词：球栅阵列(BGA) 基板 三维组装 

分 类 号：TN405[电子电信—微电子学与固体电子学]