基于分形结构的天线设计及天线-芯片一体化射频组件制造工艺  

Antenna Design Based on Fractal Structure and Fabrication of an Antenna-Chip Integrated RF Module

作　　者：王刚 赵心然 尹宇航 夏晨辉 周超杰 袁渊 王成迁 WANG Gang;ZHAO Xinran;YIN Yuhang;XIA Chenhui;ZHOU Chaojie;YUAN Yuan;WANG Chengqian(China Key System&Integrated Circuit Co.,Ltd.,Wuxi 214072,China)

机构地区：[1]中科芯集成电路有限公司,江苏无锡214072

出　　处：《电子与封装》2023年第8期77-86,共10页Electronics & Packaging

摘　　要：实现了一种基于分形结构的天线-芯片一体化射频组件的设计与制造,设计了基于4阶Hilbert曲线的分形电感和基于2阶Sierpinski三角形的天线结构,有效提高了集成模组中的空间利用率,实现了电子器件的小型化。天线结构可以通过馈电位置的变化实现辐射频点可调,最多可实现36GHz、50GHz、70.6GHz3个辐射频点,有助于实现灵活的应用场景。各辐射频点上的回波损耗大于25dB,最大辐射方向增益为11.93dB。为了实现分形天线和射频芯片的一体化集成,设计和实现了天线-芯片一体化射频组件架构与12英寸晶圆级嵌入式基板工艺。与现有的射频组件集成工艺相比,利用光刻工艺实现了天线-芯片垂直高密度互连,同时改善了系统的射频性能。An antenna-chip integrated RF module based on fractal structure is designed and fabricated.A fractal inductance based on the 4-order Hilbert curve and an antenna based on the 2-order Sierpinski triangle are designed.The space utilization rate of integrated module is improved effectively,and the miniaturization of electronic devices is realized.The radiation frequency points in antenna structure are adjustable by changing feed positions.At most,three radiation frequency points of 36 GHz,50 GHz,70.6 GHz can be realized,which makes the application scenarios flexible.The return loss at each radiation frequency point is higher than 25 dB,and the maximum radiation direction gain is 11.93 dB.In order to realize the integrated integration of fractal antenna and RF chip,an antenna-chip integrated RF module architecture with 12-inch wafer-level embedded substrate technology is designed and implemented.Compared with the existing RF module integration processes,the photolithography is used to realize vertical high-density interconnection between antenna and chip,and to improve the RF performance of the system.

关 键 词：分形结构 天线封装一体化 有机基板 再布线 晶圆级封装 

分 类 号：TN822.8[电子电信—信息与通信工程]