CSP-LED封装工艺及其散热研究  

Research on CSP-LED Packaging Process and Heat Dissipation

作　　者：林介本 郭震宁 吴荣琴 黄学铃 LIN Jieben;CUO Zhenning;WU Rongqin;HUANG Xueling(Minnan Science and Technology College,Quanzhou 362332,China;Fujian Provincial Universities Engineering Research Center for Pan Home Smart Light,Quanzhou 362332,China;Quanzhou Lighting Engineering Technology Research Institute,Quanzhou 362302,China;Fujian SIGOLED Light and Solar Energy Co.,Ltd.,Quanzhou 362302,China)

机构地区：[1]闽南科技学院,福建泉州362332 [2]泛家居智能照明福建省高校工程研究中心,福建泉州362332 [3]泉州市照明工程技术研究院,福建泉州362302 [4]福建世光新能源股份有限公司,福建泉州362302

出　　处：《中国照明电器》2023年第6期12-15,共4页China Light & Lighting

基　　金：福建高校杰出青年科研人才培育计划(闽教科[2018]47号);2020年省级新工科研究与改革实践项目(闽教高[2020]4号);泛家居智能照明福建省高校工程研究中心(闽教科[2018]89号);福建省线下一流本科课程“半导体照明技术”(闽高厅函[2019]46号);半导体照明与光伏应用创新团队(MKKYTD202301)。

摘　　要：芯片级封装(CSP)LED器件由于其体积小、发光效果好等优点成为LED企业新技术、新产品竞争的热点。本文基于正装结构、垂直结构、倒装结构3种芯片结构讨论了CSP LED封装的工艺流程,并制备了多芯片的CSP LED模组,分析了CSP LED模组的芯片结温。研究表明:倒装结构芯片适用于CSP工艺封装;合理分布CSP LED芯片,优化芯片排列间距,对控制CSP LED模组的结温,提高产品的寿命有重要的意义。Chip scale package(CSP)LED devices have become a hot topic for new technologies and products in LED enterprises due to their small size and good luminous effect.This article discusses the packaging process of CSP LED based on three chip structures:formal structure,vertical structure,and flip chip structure.CSP LED modules with multi chips were prepared,and the chip junction temperature of CSP LED modules was analyzed.Research has shown that flip chip structures are suitable for CSP packaging process;optimizing chip spacing is of great significance for controlling the junction temperature of CSP LED modules and improving product life.

关 键 词：芯片级封装 封装工艺 结温 热阻 模组 

分 类 号：TM923.34[电气工程—电力电子与电力传动]