卷绕镀铜工艺对复合集流体电学性能影响研究  

Study of the Influence of Process Parameters of Copper Coating Fabricated by Roll to Roll Machine on Electronic Property of Composite Current Collector

作　　者：张艳鹏 曹志强 付强 曹磊 刘旭 ZHANG Yan-peng;CAO Zhi-qiang;FU Qiang;CAO Lei;LIU Xu(Beijing NAURA Vacuum Technology Co.,Ltd.,Beijing 100015,China)

机构地区：[1]北京北方华创真空技术有限公司,北京100015

出　　处：《真空》2023年第4期8-12,共5页Vacuum

摘　　要：为改善锂离子电池用镀铜复合集流体的电学性能,通过控制卷绕磁控溅射走带速度、阴极功率、工艺压强、线性离子源前处理参数、NiCr打底层厚度等工艺条件,在有机基材表面沉积铜膜,通过四探针方阻测量仪测定镀铜层方阻值,得到了不同工艺参数对镀铜层方阻的影响规律。结果表明:随走带速度增加,方阻值呈二次方增大;随阴极功率增加,方阻值呈幂次方降低;工艺压强0.13~0.45Pa范围内,方阻值在0.2Pa时达到最低;离子源电流0~0.7A范围内,方阻值随离子源电流增大线性降低;NiCr打底层能够改善镀铜层的方阻,6.7nm厚的NiCr打底样品较无打底层样品方阻值降低23.2%。By controlling winding speed,cathode power,process pressure,linear ion source current,thickness of NiCr seed layer,roll to roll magnetron sputtering machine was used to deposit nano-copper film on the surface of organic film substrate,in order to improve electronic property of copper current collector.The sheet resistance of copper coating was characterized by fourprobe method,and the influence of different process parameters on the sheet resistance of copper coating were obtained.The results show that with the increase of running speed of substrate,the sheet resistance increases quadratically,and with the increase of cathode power,the sheet resistance decreases in power.In the process pressure range of 0.13~0.45Pa,the sheet resistance reaches the minimum at 0.2Pa.With the ion source current increasing in the range of 0~0.7A,the sheet resistance decreases linearly.NiCr seed layer can improve the sheet resistance of copper layer,and the sheet resistance of copper coating with 6.7nm NiCr seed layer is 23.2%lower than that of copper coating without seed layer.

关 键 词：复合集流体 卷绕镀膜 磁控溅射 镀铜 方块电阻 

分 类 号：TB43[一般工业技术]