热循环加载下微系统封装结构有限元仿真方法研究  

Research on finite element simulation method of microsystem packaging structure under thermal cycling loading

作　　者：邵凤山 何峥纬 刘豪 华腾飞 仇原鹰[1] 李静[1] SHAO Fengshan;HE Zhengwei;LIU Hao;HUA Tengfei;QIU Yuanying;LI Jing(School of Mechatronic Engineering,Xidian University,Xi’an 710071,China)

机构地区：[1]西安电子科技大学机电工程学院,陕西西安710071

出　　处：《微电子学与计算机》2023年第11期121-127,共7页Microelectronics & Computer

基　　金：陕西省自然科学基础研究计划(2023-JC-YB-328);中央高校基本科研业务费专项资金项目(ZYTS23014)。

摘　　要：微系统封装结构中,由循环热应力引起的封装失效是影响其可靠性的重要因素之一.现阶段通常采用大量的可靠性试验来验证封装结构工艺的可靠性,但是有限元仿真技术的发展为此类问题的解决提供了更为简单快捷的途径.利用ANSYS Workbench软件,对某微系统封装结构进行了系统的有限元仿真,深入探究了封装结构中球栅阵列(BGA)焊点的网格类型、网格密度和加载循环数量对仿真结果的影响.研究结果为提高微系统封装结构的有限元仿真效率及优化设计提供了重要参考,也为进一步研究微系统封装结构在复杂工况下的可靠性提供了有益思路.In the packaging structure of microsystems,package failure caused by thermal stress is an important reason affecting its reliability.At this stage,a large number of reliability tests are usually required to verify the reliability of the packaging structure process.The emergence of finite element simulation methods provides a simpler and more accurate way for such problems.In this study,the finite element simulation of the microsystem package structure was carried out by ANSYS Workbench software,and the influence of the grid type,grid density and number of cycles of the Ball Grid Array(BGA)solder joints in the package structure on the simulation results was systematically explored.The research results provide important reference and theoretical guidance for improving the finite element simulation efficiency and optimal design of microsystem packaging structures,and also provide useful ideas for further research on the reliability of microsystem packaging structures under complex working conditions.

关 键 词：微系统封装 有限元仿真 BGA焊点 封装可靠性 

分 类 号：TN401[电子电信—微电子学与固体电子学]