共蒸发法制备金锡共晶焊料环及其性能研究  

Study on preparation and properties of gold-tin eutectic solder ring by coevaporation method

作　　者：李萌萌 李兆营 黄添萍 LI Mengmeng;LI Zhaoying;HUANG Tianping(Vital Optics Technology Co Ltd,Chuzhou 239000,China)

机构地区：[1]安徽光智科技有限公司,安徽滁州239000

出　　处：《传感器与微系统》2024年第1期59-61,共3页Transducer and Microsystem Technologies

摘　　要：采用电子束共蒸发法制备了金锡共晶(Au80Sn20)焊料环,与非制冷红外探测器芯片进行气密性封装。通过SEM、AFM、X-ray、振荡测试以及测漏氦等方式验证了封装后芯片的气密性和可靠性。结果表明:键合后焊料环无明显缺陷,仅存在轻微溢料现象;经过振荡测试,溢料无脱落、无位移,且芯片密封性能可达到1×10^(-3) Pa/(cm^(3)·s),符合探测器的气密性要求。Electron beam coevaporation is used to prepare gold-tin eutectic(Au_(80)Sn_(20))solder rings for airtightness packaging with uncooled infrared detector chips.The airtightness and reliability of the packaged chips are verified through SEM,AFM,X-ray,vibration testing and helium leak testing.The result shows that there are no obvious defects in the solder ring after bonding,and only a slight overflow phenomenon exists.After vibration testing,the overflow material has no detachment or displacement,and the chip sealing performance can reach 1×10^(-3) Pa/(cm^(3)·s),meeting the airtightness requirements of the detector.

关 键 词：非制冷红外探测器 晶圆级封装 电子束蒸发 金锡共晶焊料环 键合 

分 类 号：TN305.8[电子电信—物理电子学] TN305.94