陶瓷基板抛光技术研究现状  

Research Status of Ceramic Substrate Polishing Technologies

作　　者：姚忠樱 常逸文 崔鸽 张洪波[1] 任瑞康[1] 任佳乐[1] 旷峰华[1] YAO Zhongying;CHANG Yiwen;CUI Ge;ZHANG Hongbo;REN Ruikang;REN Jiale;KUANG Fenghua(Ceramics Science Institute,China Building Materials Academy,Beijing 100024,China)

机构地区：[1]中国建筑材料科学研究总院陶瓷科学研究院,北京100024

出　　处：《陶瓷学报》2023年第6期1093-1102,共10页Journal of Ceramics

基　　金：国家自然科学基金(52032011)。

摘　　要：随着集成电路和半导体行业的快速发展,具有高表面精度和低粗糙度的陶瓷基板成为封装基板的最佳选择,而抛光工序作为陶瓷基板生产过程中最为关键的环节,决定了产品整体质量的好坏。围绕着陶瓷基板抛光,包括化学机械抛光、磨料流抛光、超声振动辅助磨料流抛光、电泳抛光、电解抛光以及磁流变抛光等常见抛光技术的基本原理和适用范围,总结了氧化铝、氮化硅、碳化硅、氧化铍、氮化铝等陶瓷基板常用的抛光技术及其研究现状,并展望了陶瓷基板抛光技术的发展趋势。With the rapid development of integrated circuit and semiconductor industries,ceramic substrates with high surface accuracy and low roughness have become the best choice for packaging substrates,where the polishing process,as the most critical step in the production process,determines the overall quality of the of ceramic substrates.Focusing on the basic principles and application scope of common polishing technologies for ceramic substrates,including chemical mechanical polishing,abrasive flow polishing,ultrasonic vibration assisted abrasive flow polishing,electrophoretic polishing,electrolytic polishing,and magnetorheological polishing,this paper was aimed to summarize the commonly used polishing technologies and their research status for ceramic substrates,such as alumina,silicon nitride,silicon carbide,beryllium oxide and aluminum nitride,Besides,the development trend of ceramic substrate polishing technology will be discussed.

关 键 词：陶瓷基板 抛光技术 氧化铝 氮化硅 碳化硅 氧化铍 氮化铝 

分 类 号：TQ174.75[化学工程—陶瓷工业]