CBGA、CCGA返工中的除锡工艺  

Desoldering Process in Rework of CBGA and CCGA

作　　者：施维 SHI Wei(Suzhou Ruijun Electronic Technology Co.,Ltd.,Suzhou 215101,China)

机构地区：[1]苏州瑞骏电子科技有限公司,江苏苏州215101

出　　处：《电子工艺技术》2024年第2期44-47,共4页Electronics Process Technology

摘　　要：CBGA和CCGA在板级组装时,常出现焊接不良等缺陷,导致电路无法继续使用。为降低成本、保证研制进度,需要进行植球植柱返工。除锡工艺作为植球植柱返工的第一个步骤,对后续工艺流程有较大影响。此外除锡工艺中焊料的残留量、镍层的熔蚀、金属间化合物(IMC)厚度和成分的变化都会影响器件的可靠性。对比了CBGA和CCGA的4种除锡工艺,通过切片分析方法观察测量了不同工艺下焊点的显微结构,并由此分析它们对器件可靠性的影响。CBGA and CCGA tend to have poor solder joints or other defects during board-level assembly,leading to the inability of the circuit to continue using.In order to reduce costs and ensure the development progress,it is necessary to carry out rework of planting balls and columns.As the first step of the rework,the desoldering process has a major impact on the subsequent process flow.The amount of solder residue,the erosion of the nickel plating layer,and the thickness and composition changes of the intermetallic compound during the desoldering process can all affect the reliability of the device.Four desoldering processes for CBGA/CCGA are compared,and the microstructure of solder joints under different processes is observed and measured using X-section,thereby analyzing their impact on device reliability.

关 键 词：CBGA CCGA 植球 植柱 返工 除锡 可靠性 

分 类 号：TN605[电子电信—电路与系统]