基于Anand模型的BGA封装热冲击循环分析及焊点疲劳寿命预测  

Thermal Impact Cycle Analysis and Solder Joint Fatigue Life Prediction of BGA Package Based on Anand Model

作　　者：张惟斌[1] 申坤 姚颂禹 江启峰 ZHANG Weibin;SHEN Kun;YAO Songyu;JIANG Qifeng(Key Laboratory of Fluid and Power Machinery,Ministry of Education,Xihua University,Chengdu 610039,China;School of Energy and Power Engineering,Xihua University,Chengdu 610039,China)

机构地区：[1]西华大学流体及动力机械教育部重点实验室,成都610039 [2]西华大学能源与动力工程学院,成都610039

出　　处：《电子与封装》2024年第3期45-49,共5页Electronics & Packaging

基　　金：四川省科技厅资助项目(2020YFH152)。

摘　　要：BGA封装在电子元器件中的互连、信息传输等方面起着重要作用,研究封装元件的可靠性以及内部焊点在高温、高湿、高压等极限条件下的稳定性显得尤为重要。基于Anand模型分析了封装元件在热冲击下的塑性变形和应力分布,同时对不同空间位置焊点的最大应力与主要失效位置进行了对比,并运用Darveaux模型计算出焊点最危险单元的裂纹萌生、裂纹扩展速率和疲劳寿命。结果表明,在热冲击极限载荷下,封装元件的温度呈现对称分布,表面温度与内部温度差较大,约为15℃;最大变形为0.038 mm,最大变形位置为外侧镀膜处;最大应力为222.18 MPa,内部其余部分的应力值为20 MPa左右。对于内部焊点,最大应力为19.02 MPa (250 s),应力最大位置在锡球下方边缘,预估其疲劳寿命为6.29天。BGA package plays an important role in the interconnection and information transmission of electronic components.It is particularly important to study the reliability of package components and the stability of internal solder joints under extreme conditions such as high temperature,high humidity and high pressure.Based on the Anand model,the plastic deformation and stress distribution of the package component under thermal shock are analyzed.At the same time,the maximum stress and the main failure position of the solder joints at different spatial positions are compared.The Darveaux model is used to calculate the crack initiation,crack propagation rate and fatigue life of the most dangerous unit of the solder joints.The results show that under the thermal shock limit load,the temperature of the package component is symmetrically distributed,and the difference between the surface temperature and the internal temperature is large,which is about 15 C.The maximum deformation is 0.038 mm,and the maximum deformation position is at the outer coating.The maximum stress is 222.18 MPa,and the stress value of the rest of the interior is about 20 MPa.For the internal solder joints,the maximum stress is 19.02 MPa(250 s),and the maximum stress position is at the edge below the solder balls.It is estimated that the fatigue life is 6.29 days.

关 键 词：BGA封装 Anand模型 焊点 热冲击 疲劳寿命 

分 类 号：TG405[金属学及工艺—焊接] TN305.94[电子电信—物理电子学]