高阶参数的实时反馈技术对套刻误差的优化  

Analysis of Real-time Feedback Technology of High-Order Parameters for Optimizing Etching Errors

作　　者：余洋 董佳 袁伟 YU Yang;DONG Jia;YUAN Wei(Shanghai Integrated Circuit Equipment Materials Industry Innovation Center Co.,Ltd.,Shanghai 201800,China)

机构地区：[1]上海集成电路装备材料产业创新中心有限公司,上海201800

出　　处：《集成电路应用》2024年第4期372-374,共3页Application of IC

摘　　要：阐述套刻误差补偿的常用分析模型,介绍挂载高阶套刻子处方(EEXY)是目前高阶参数补偿在光刻机端实现的主要形式。对比基于ASML LIS的EEXY实时反馈(LIS Run-to-Run)与传统基于APC的线性10参数实时反馈,以及目前先进节点普遍采用的10par Run-to-Run+静态EEXY反馈的方法对套刻误差的影响。分析表明,高阶套刻参数实时反馈相对于其他两种方案,无论是X方向还是Y方向,套刻误差均有明显的改善。This paper expounds the commonly used analytical models for offset error compensation and introduces that mounting high-order offset sub prescription(EEXY)is currently the main form of high-order parameter compensation implemented on lithography machines.It compares the impact of ASML LIS based EEXY real-time feedback(LIS Run to Run)with traditional APC based linear 10 parameter real-time feedback,as well as the commonly used 10par Run to Run+static EEXY feedback method in advanced nodes on the etching error.Analysis shows that real-time feedback of high-order etching parameters significantly improves the etching error in both the X and Y directions compared to the other two schemes.

关 键 词：光刻机 套刻 高阶参数 线性参数 

分 类 号：TN405[电子电信—微电子学与固体电子学]