塑封器件使用风险与应对措施分析  

Analysis of Risk and Countermeasures for the Use of Plastic Encapsulated Microcircuits

作　　者：李泱 王宇[1] 王思思 贾博涛 郭焕焕 LI Yang;WANG Yu;WANG Sisi;JIA Botao;GUO Huanhuan(China Academy of Launch Vehicle Technology,Beijing 100076,China)

机构地区：[1]中国运载火箭技术研究院,北京100076

出　　处：《集成电路应用》2024年第5期72-73,共2页Application of IC

摘　　要：阐述塑封器件使用中的风险,包括温度适应性、潮气入侵、塑封器件分层、高可靠领域使用商用塑封器件。从器件选用和保证、可靠性评估保证措施方面,提出塑封器件使用的应对措施。This paper describes the risks in the use of plastic packaging devices,including temperature adaptability,moisture intrusion,delamination of plastic packaging devices,and the use of commercial plastic packaging devices in highly reliable fields.It proposes countermeasures for the use of plastic sealed devices from the aspects of device selection and assurance,reliability evaluation and assurance measures.

关 键 词：集成电路 塑封器件 可靠性评估 

分 类 号：TN406[电子电信—微电子学与固体电子学]