高速电镀铜技术在先进封装金属互连中的研究进展  

Research Progress of High-Speed Copper Electroplating Technology in Advanced Packaging Metal Interconnection

作　　者：陈平 夏良 贺京峰 刘冰 Chen Ping;Xia Liang;He Jingfeng;Liu Bing(Guizhou Zhenhua Fengguang Semiconductor Co.,Ltd.,Guiyang 550018,China)

机构地区：[1]贵州振华风光半导体股份有限公司,贵阳550018

出　　处：《微纳电子技术》2024年第7期54-61,共8页Micronanoelectronic Technology

摘　　要：简单阐述了高速电镀铜技术在先进封装金属互连结构中的应用,重点介绍了电镀液、电镀设备和工艺控制三个因素对电镀速率和质量的影响,并对国内外电镀液添加剂种类、电镀液配方、电镀设备对流传质速率、电镀设备电流密度控制能力以及电镀工艺参数优化等因素对高速电镀铜沉积速率和质量的影响进行了评述。最后,总结了不同晶粒取向和晶粒大小的铜镀层在先进封装混合键合技术中的应用优势,并展望了高速电镀技术未来的应用领域与发展方向。The application of high-speed copper electroplating technology in advanced packaging metal interconnection structures is briefly introduced.The effects of three factors of electroplating solution,electroplating equipment and process control on the electroplating rate and quality are emphatically introduced.The effects of factors such as the types of electroplating solution additives,electroplating solution formulations,mass transfer rate of electroplating equipment,current density control ability of electroplating equipment and optimization of electroplating process parameters on the deposition rate and quality of high-speed copper electroplating are reviewed both home and abroad.Finally,the application advantages of copper coatings with different grain orientations and sizes in advanced packaging hybrid bonding technology are summarized,and the future application field and development direction of the high speed electroplating technology are prospected.

关 键 词：高速电镀 先进封装 金属互连 酸性镀铜 工艺优化 

分 类 号：TN305.2[电子电信—物理电子学] TQ153[化学工程—电化学工业]