SiP的模块化发展趋势  

Modulization Trends of SiP

作　　者：William Koh William Koh(Pacrim Technology Inc.,Irvine,CA 92602)

机构地区：[1]Pacrim Technology Inc.,Irvine,CA 92602

出　　处：《电子与封装》2024年第7期21-28,共8页Electronics & Packaging

摘　　要：系统级封装(SiP)技术已广泛应用于移动设备、可穿戴设备、健康和医疗设备、人工智能(AI)、物联网(IoT)和汽车电子。SiP采用异构集成的方式,将各种芯片和元件集成到一个封装中,以实现特定功能,并具有节省电路板空间、简化布局设计和降低制造成本等优势。随着电子组件的小型化发展方向不断持续,一些SiP已经发展成为模块或系统级模块(SiM),可以直接连接并安装到器件中。回顾了SiP从多芯片模块(MCM)、多芯片封装(MCP)到高级芯粒封装和共封装光学器件(CPO)的演变。未来几年,更多的SiP将变成SiM,直接连接器件或系统。System in package(SiP)technology has been applied widely for mobile devices,wearables,health and medical devices,artificial intelligence(AI),Internet of Things(IoT),and automotives.SiP deploys heterogeneous integration to group various chips and components in a single package to achieve a specific function,and has advantages such as saving board space,simplifying layout design,and reducing fabrication cost.As the miniaturization of electronic assemblies continues,some SiPs have evolved to be modules,or system in modules(SiMs)that can be connected and fitted directly into a device.The evolution of SiP from multi-chip module(MCM),multi-chip package(MCP)to advanced Chiplet package and the co-packaged optics(CPO)is reviewed.In the coming years,more SiPs will turn into SiMs for direct connection to devices or systems.

关 键 词：系统级封装 系统级模块 多芯片模块 

分 类 号：TN305.94[电子电信—物理电子学]