倒装芯片的底部填充工艺研究  

Research on Underfill Process of Flip Chip

作　　者：李圣贤 丁增千 LI Shengxian;DING Zengqian(GUSU Laboratory of Materials,Suzhou 215123,China)

机构地区：[1]材料科学姑苏实验室,江苏苏州215123

出　　处：《电子与封装》2024年第7期50-56,共7页Electronics & Packaging

摘　　要：倒装芯片技术被广泛应用于先进封装技术领域,可以有效解决芯片与基板之间因应力不匹配产生的可靠性问题。底部填充工艺通过在芯片和基板的间隙填充有机胶,使得应力可以被重新分配,进而起到保护焊点的作用,提升封装可靠性。随着芯片不断向轻薄化方向发展,芯片尺寸的缩减和结构的精细化导致对填充材料的性能及封装可靠性的要求不断提高,底部填充工艺面临着更大的挑战。材料设计、工艺优化等措施是应对潜在挑战的有效方式。Flip chip technology is widely used in the field of advanced package technology,which can effectively solve the reliability problem caused by stress mismatch between the chip and the substrate.By filling the gap between the chip and the substrate with organic adhesive,the underfill process allows the stress to be redistributed,and thus plays a role in protecting the solder joint and improves the reliability of the package.With the continuous development of the chip to the trend of thin and light,the reduction of chip size and refinement of structure have led to increasing requirements for the filling material performance and package reliability,and the underfill process is facing greater challenges.Measures such as material design and process optimization are effective ways to deal with potential challenges.

关 键 词：封装技术 倒装芯片 底部填充工艺 

分 类 号：TN305.94[电子电信—物理电子学]