X波段三维异构片式收发SiP模块设计  

Design of 3D heterogeneous film-based transceiver SiP module in X-band

作　　者：李晓林 刘星[1] 高艳红 赵宇[1] 许春良[1] LI Xiaolin;LIU Xing;GAO Yanhong;ZHAO Yu;XU Chunliang(The 13th Research Institute,China Electronics Technology Group Corporation,Shijiazhuang Hebei 050051,China)

机构地区：[1]中国电子科技集团公司第十三研究所,河北石家庄050051

出　　处：《太赫兹科学与电子信息学报》2024年第7期758-763,767,共7页Journal of Terahertz Science and Electronic Information Technology

摘　　要：采用硅基三维异构集成技术,在极小的体积内,将多个微波单片集成电路(MMIC)和无源功分网络一体化集成,实现了一种X波段4通道片式收发系统级封装(SiP)。该SiP由2个体硅堆叠封装(PoP)而成,不同封装通过球栅阵列(BGA)方式互连,单层封装的内部腔体上下面均贴装芯片,封装内部采用硅通孔技术(TSV)实现垂直互连,SiP尺寸为14 mm×14 mm×3.2 mm。测试结果表明,在8~12 GHz内,SIP 4个通道的发射饱和输出功率≥30.5 dBm,接收增益≥24.5 dB,噪声系数≤3 dB,接收输入P-1≥-26 dBm,同时具备6位数控移相和6位数控衰减功能,重量约1 g,可广泛用于微波收发系统。A four-channel X-band chip transceiver System in a Package(SiP)module was realized by integrating multiple Monolithic Microwave Integrated Circuits(MMICs)and passive power division network into a very compact volume using silicon-based 3D heterogeneous integration technology.The module is Package on Package(PoP)stacked by two silicon-based packages,and the different packages are interconnected through the Ball Grid Array(BGA)mode.Chips are installed on the upper and lower surfaces of the inner cavity of a single package.The internal package is vertically interconnected using Through Silicon Via(TSV)and the module dimensions are 14 mm×14 mm×3.2 mm.The test results show that within 8~12 GHz,the transmission saturation output power of the module is≥30.5 dBm,the receiving gain is≥24.5 dB,the noise figure is≤3 dB,the receiving input P-1 is≥-26 dBm,and it also features 6-bit digital phase shifting and 6-bit digital attenuation capabilities,weighs approximately 1 g.It can be widely used in microwave transceiver system.

关 键 词：三维异构集成 堆叠封装 高集成 片式 系统级封装 

分 类 号：TN838[电子电信—信息与通信工程] TN851