溅射气压对铜基复合薄膜结合性能的影响  

Effect of Sputtering Pressure on Bonding Properties of Copper Based Composite Films

作　　者：徐全国 张健[1] 宗世强 XU Quanguo;ZHANG Jian;ZONG Shiqiang(School of Mechanical and Power Engineering,Shenyang University of Chemical Technology,Shenyang Liaoning 110142,China)

机构地区：[1]沈阳化工大学机械与动力工程学院,辽宁沈阳110142

出　　处：《辽宁化工》2024年第7期1005-1007,1011,共4页Liaoning Chemical Industry

基　　金：国家科技型中小企业技术创新基金项目(项目编号:2022210101000301)。

摘　　要：采用直流磁控溅射的方式,在镀有镍层的铜箔基底上改变设备溅射气压分别沉积铬、钴、钛薄膜,再用水电镀在这3种薄膜表面制备铜膜,对薄膜的表面能和结合力进行研究,用达因法和万能拉力仪进行检测。结果表明:随着溅射气压的增大,铬薄膜的表面能先减小后增大,直到气压0.8 Pa时不再变化,钴薄膜的表面能先增大后减小,2种薄膜的表面能变化趋势都在气压0.5 Pa时发生转折,钛薄膜的表面能一直保持不变。铬和钴薄膜的结合力在0.3~0.5 Pa时维持不变,之后开始下降,钛薄膜的结合力先上升再降低,其在气压0.5 Pa时发生转变。By DC magnetron sputtering,chromium,cobalt and titanium films were deposited on the copper foil substrate with nickel coating by changing the sputtering pressure of the equipment,and then copper films were prepared on the three kinds of films by water electroplating.The results showed that,with the increase of sputtering pressure,the surface energy of chromium thin films first decreased and then increased until the pressure was 0.8 Pa,and the surface energy of cobalt thin films first increased and then decreased,the change trend of surface energy of both films occurred at a pressure of 0.5 Pa,and the surface energy of titanium films remained unchanged.The binding force of chromium and cobalt thin films remained unchanged at 0.3~0.5 Pa and then began to decrease.The binding force of titanium thin films first increased and then decreased,and a transition occurred at 0.5 Pa.

关 键 词：磁控溅射 结合力 表面能 溅射气压 

分 类 号：TQ051.4[化学工程]