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作 者:龙勇[1] 肖梦涵 陈哲明 邹少红 刘善琼 石自彬[1] 丁雨憧[1] 马晋毅[1] LONG Yong;XIAO Menghan;CHEN Zheming;ZOU Shaohong;LIU Shanqiong;SHI Zibin;DING Yuchong;MA Jinyi(The 26th Institute of China Electronics Technology Group Corporation,Chongqing 400060,China)
机构地区:[1]中国电子科技集团公司第二十六研究所,重庆400060
出 处:《压电与声光》2024年第4期591-595,共5页Piezoelectrics & Acoustooptics
摘 要:声表面波(SAW)滤波器急需使用高质量的钽酸锂压电单晶复合薄膜衬底材料来提升性能。离子注入后,晶圆翘曲增大,颗粒增加,键合工艺易产生不规则条纹和键合空洞等缺陷,严重阻碍高质量钽酸锂压电单晶复合薄膜材料的制备。通过X线衍射(XRD)、聚焦离子束透射电镜(FIB-TEM)及颗粒测试仪等设备对注入内部应力、损伤和颗粒变化进行分析表征,解释了翘曲增大和颗粒增多的原因,并提出了相应的解决方法,最后成功制备了翘曲低、颗粒少的注入晶圆。通过键合工艺进一步验证,获得了无条纹和空洞等缺陷的高质量键合晶圆,为钽酸锂压电单晶复合薄膜的高效制备奠定了基础。Currently,surface acoustic wave filters urgently require high-quality lithium tantalate piezoelectric single crystal composite film substrates to improve performance.After ion implantation,wafer warpage and particle increase can easily occur,leading to defects such as irregular stripes and bonding voids during the subsequent bonding process,which seriously hinder the preparation of high-quality lithium tantalate piezoelectric single crystal composite films.The internal stress,damage,and particle changes caused by ion implantation were analyzed and characterized using X-ray diffraction(XRD),focused ion beam-transmission electron microscopy(FIB-TEM),particle tester,and other equipment.The reasons for the increase in warpage and particles were explained,and appropriate solutions were proposed.Finally,the implanted wafer was successfully prepared with low warpage and fewer particles.Further verification of the bonding process revealed that high-quality bonded wafers without defects such as stripes and voids can be obtained,laying the foundation for the efficient preparation of lithium tantalate piezoelectric single crystal composite films.
分 类 号:TN384[电子电信—物理电子学] TN305[一般工业技术—材料科学与工程] TM22[电气工程—电工理论与新技术]
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