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作 者:杜少博[1] 何洪涛[1] DU Shaobo;HE Hongtao(The 13th Research Institute of CETC,Shijiazhuang 050051,China)
机构地区:[1]中国电子科技集团公司第十三研究所,石家庄050051
出 处:《电子工艺技术》2024年第5期21-23,35,共4页Electronics Process Technology
摘 要:从制约高温压力传感器发展的耐高温金属体系研究出发,采用钨/氮化钽/铂(W/TaN/Pt)作为金属布线的电传导层,开发出适用于500 ℃高温环境下稳定工作的金属薄膜,实现电信号稳定传输,有效避免相邻金属层之间相互扩散或合金导致的电性能失效。对500 ℃高温前后的压力传感器进行带电测试,并对非线性、迟滞性、灵敏度、重复性等8项指标做了测试对比,高温压力传感器性能稳定,各性能指标均满足使用要求,证明该金属体系的可行性。Starting from the research on high temperature resistant metal system that constrain the development of high temperature pressure sensor,W/TaN/Pt is used as the electrical conduction layer,and a metal thin film suitable for stable operation at 500 ℃ is developed to achieve stable transmission of electrical signals and effectively avoid electrical performance failure caused by mutual diffusion or alloy between adjacent metal layers.Charged tests are conducted on pressure sensor before and after a high temperature of 500 ℃,and 8 indicators including nonlinearity,hysteresis,sensitivity,and repeatability are compared.The performance of the high temperature pressure sensor is stable,and all performance indicators meet the requirements for use,proving the feasibility of the metal system.
分 类 号:TN605[电子电信—电路与系统]
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