离子束表面加工设备及工艺研究  

Research of Ion Beam Surface Processing Equipment and Production Technology

作　　者：范江华 李勇 袁祖浩 龚俊 胡凡 黄也 FAN Jiang-hua;LI Yong;YUAN Zu-hao;GONG Jun;HU Fan;HUANG Ye(The 48th Research Institute of CETC)

机构地区：[1]中国电子科技集团公司第四十八研究所

出　　处：《中国集成电路》2024年第9期87-91,共5页China lntegrated Circuit

摘　　要：本文介绍了一种用于红外芯片金属化与刻蚀工艺的离子束表面加工设备。通过实验探索不同工艺角度下薄膜沉积速率与均匀性及刻蚀速率与均匀性的影响,结果表明薄膜沉积均匀性与刻蚀均匀性均优于3%。同时经过产线流片,红外芯片表面薄膜均匀性良好、一致性高,芯片电路图案刻蚀陡直性高、损伤低,满足红外芯片金属化与刻蚀工艺需求。An ion beam surface processing equipment for metallization and etching of infrared chips is introduced in this paper.The effects of deposition rate and etch rate on film uniformity under different process angles are investigated.The results show that both the deposition uniformity and etch uniformity are better than 3%.At the same time,through the production line flow sheet,the infrared chip surface film uniformity is good,high consistency,chip circuit pattern etching steepness,low damage,to meet the requirements of infrared chip metallization and etching process.

关 键 词：离子束溅射沉积 离子束刻蚀 离子束加工 射频离子源 

分 类 号：TN405[电子电信—微电子学与固体电子学]