脉冲电流和溅射气压对轴瓦内表面制备Al-Sn-Cu薄膜的影响  

Effect of Pulsed Current and Sputtering Pressure on the Preparation of Al-Sn-Cu Film on the Inner Surface of the Bearing Shell

作　　者：唐玉峰 张健[1] 唐智聪 TANG Yufeng;ZHANG Jian;TANG Zhicong(School of Mechanical and Power Engineering,Shenyang University of Chemical Technology,Shenyang 110142,China)

机构地区：[1]沈阳化工大学机械与动力工程学院,沈阳110142

出　　处：《机械工程师》2024年第12期35-38,共4页Mechanical Engineer

基　　金：国家科技型中小企业技术创新基金(2022210101000301)。

摘　　要：通过脉冲直流磁控溅射技术在铜合金轴瓦内表面制备Ni过渡层后制备Al-Sn-Cu薄膜。为了得到更好的薄膜制备工艺,利用SEM扫描电子显微镜和EDS能谱仪对制得的Al-Sn-Cu薄膜表面进行检测分析,探究了溅射气压、脉冲直流电源的电流及Ni过镀层对制得的薄膜表面形貌及结合强度的影响。结果表明,适当的溅射气压和增大脉冲电流有利于薄膜的沉积,提高了薄膜的平整性和致密性。制备Ni过渡层有利于增强薄膜晶体结构的稳定性,提高薄膜与轴瓦的结合力。增强Al-Sn-Cu薄膜表面的均匀性和致密性,可以减轻薄膜表面的氧化。Al-Sn-Cu film is prepared by pulsed DC magnetron sputtering technology after preparing the Ni transition layer on the inner surface of the copper alloy bearing shell.In order to obtain a better film preparation process,SEM scanning electron microscope and EDS spectrometer are used to detect and analyze the surface of the prepared Al-Sn-Cu film.This paper explores the influence of sputtering air pressure,pulsed DC power supply current and Ni overcoating on the surface morphology and bonding strength of the prepared film.The results show that the appropriate sputtering air pressure and increasing pulse current are conducive to the deposition of the film,and the flatness and compactness of the film are improved.The preparation of Ni transition layer is beneficial to enhance the stability of the crystal structure of the thin film and improve the adhesion between the film and the bearing shell.Enhancing the uniformity and compactness of the Al-Sn-Cu film surface can reduce the oxidation of the film surface.

关 键 词：磁控溅射 溅射气压 脉冲电流 表面形貌 

分 类 号：TB34[一般工业技术—材料科学与工程]