芯片焊盘加固提升Au-Al键合可靠性研究  

Research on Improving Au-Al Bonding Reliability by Chip Pad Reinforcement

作　　者：王亚飞 杨鲁东 吴雷 李宏 WANG Yafei;YANG Ludong;WU Lei;LI Hong(Beijing Sevenstar Micro-Electronics Co.,Ltd.,Beijing 101200,China)

机构地区：[1]北京七星华创微电子有限责任公司,北京101200

出　　处：《电子与封装》2024年第11期41-47,共7页Electronics & Packaging

摘　　要：在芯片铝焊盘的表面制备Cu/Ni/Au凸块来对芯片进行焊盘加固,通过焊盘结构的优化解决常规芯片铝焊盘在金丝键合时存在的工艺窗口小和金铝键合长期可靠性的问题。进行焊盘加固后的芯片强度大幅度提升,有效避免了键合时击穿焊盘下介质层导致的短路问题。Ni层的存在有效避免了高温贮存时金属间化合物的生长导致的柯肯达尔空洞问题。通过试验证实了焊盘加固能大幅提高引线键合的工艺窗口,在300℃、24 h的高温贮存试验中焊盘加固后的界面组织保持高度稳定。Cu/Ni/Au bump is prepared on the surface of the aluminum pad of the chip to strengthen the chip pad,the problems of small process window and long-term reliability of gold-aluminum bonding in conventional chip aluminum pad are solved by optimizing the structure of the pad.The strength of the chip is greatly improved after pad reinforcement,which effectively avoids short-circuit problem caused by the breakdown of the dielectric layer under the pad during bonding.It is proved by experiments that the process window of wire bonding can be greatly improved by pad reinforcement,and the interface organization after pad reinforcement remains highly stable in a high-temperature storage test at 300℃and 24 h.

关 键 词：引线键合 金属间化合物 焊盘加固 凸块 可靠性 封装技术 

分 类 号：TN305.94[电子电信—物理电子学]