漫话半导体先进封装技术中的新网版印刷(四)  

New Screen Printing in Advanced Packaging Technology for Semiconductors(Part 4)

作　　者：熊祥玉 巢亚平 陈港能 李蓉 XIONG Xiangyu;CHAO Yaping;CHEN Gangneng;LI Rong

机构地区：[1]不详

出　　处：《丝网印刷》2024年第23期19-24,共6页Screen Printing

摘　　要：先进封装技术通过平面与空间上的革新,实现连接的密集化、堆叠的多样化和功能的系统化,从平面向三维发展,从功能化向智能化发展。网版印刷技术参与到先进封装制造技术之中,完成诸如SiP类芯片的封装工作。Through the innovation of plane and space,advanced packaging technology realizes the densifi cation of connections,the diversifi cation of stacks and the systematization of functions,from the fl at to the three-dimensional development,from the functional to the intelligent development.Screen printing technology is involved in advanced packaging manufacturing technology to complete the packaging work such as SiP chip.

关 键 词：先进封装 功能化 智能化 网版印刷技术 SiP芯片 

分 类 号：TS871.1[轻工技术与工程] TN405[电子电信—微电子学与固体电子学]