漫话半导体先进封装技术中的新网版印刷(七)  

New Screen Printing in Advanced Packaging Technology for Semiconductors(Part 7)

作　　者：熊祥玉 巢亚平 陈港能 李蓉 XIONG Xiangyu;CHAO Yaping;CHEN Gangneng;LI Rong

机构地区：[1]不详

出　　处：《丝网印刷》2025年第2期15-24,共10页Screen Printing

摘　　要：介绍AMB陶瓷基板的性能,由于其在IGBT中特别优异的特性而广受电子工业、微电子制造领域的青睐。网版印刷工艺的厚膜金属化技术,使厚膜与陶瓷基板的附着性强,达到先进封装技术要求。This paper introduces the performance of AMB ceramic substrate,which is widely used in electronic industry and microelectronics manufacturing because of its excellent characteristics in IGBT.The thick film metallization technology of screen printing process makes the adhesion between thick film and ceramic substrate strong,and meets the requirements of advanced packaging technology.

关 键 词：陶瓷基板 网版印刷 厚膜技术 

分 类 号：TS871.1[轻工技术与工程]