3D封装BGA器件控温焊接工艺研究  

Research on Temperature Controlled Reflow Soldering Process for 3D Packaged BGA Device

作　　者：郭立[1] 高鹏 张婷婷 耿煜 田翔文 GUO Li;GAO Peng;ZHANG Tingting;GENG Yu;TIAN Xiangwen(China Academy of Space Technology,Beijing 100094;Space Star Technology Co.Ltd.,Beijing 100095)

机构地区：[1]中国空间技术研究院,北京100094 [2]航天恒星科技有限公司,北京100095

出　　处：《宇航材料工艺》2025年第1期87-92,共6页Aerospace Materials & Technology

摘　　要：航天用3D封装BGA器件在印制板组装件的焊接过程中存在温度限制,无法与其他大尺寸面阵列器件(例如BGA、CCGA、LGA)的焊接温度相兼容,在回流焊过程中需对3D BGA器件实施控温焊接。本文专为3D封装BGA器件设计了回流焊控温焊接工装,并构建了热仿真模型,模拟了该器件在回流焊过程中的焊接情况。同时,还对采用控温工装进行的回流焊接过程进行了试验,以验证仿真数据的准确性。结果显示,控温工装能有效降低器件温度,其中工装顶部遮挡了焊接环境中上部的射流,对器件温度的影响最为显著。试验结果与仿真结果相吻合,证实了仿真结果的准确性和有效性,表明可采用仿真方法缩短实验周期。对使用工装回流焊接后的器件进行微观组织分析发现,焊接后的器件焊点完整,无明显缺陷,内部状态良好,焊点均形成了连续的扇贝状界面层,且IMC层厚度均满足航天标准要求。The 3D packaged BGA devices used in aerospace had temperature limitations during the soldering process of printed circuit board assemblies,which were incompatible with the soldering temperature of other large-sized surface array devices(such as BGA,CCGA,LGA).Therefore,temperature controlled soldering was required for the 3D BGA devices during the reflow soldering process.This article designed a reflow soldering temperature controlled soldering fixture for 3D packaged BGA devices,established a thermal simulation model,simulated the soldering process of the device during reflow soldering.Additionally,experiments were conducted on the reflow soldering process using the temperature controlled fixture to verify the accuracy of the simulation data.The results show that temperature control fixtures can effectively reduce device temperature,and the top of the fixture blocks the upper jet in the welding environment,which has the greatest impact on device temperature.The experimental results are consistent with the simulation results,proving that the simulation results are accurate and effective,and simulation methods can be used to reduce the experimental period.Microstructure analysis is conducted on the device after reflow soldering using fixtures.The solder joints of the device are intact,without obvious defects,and the internal state is good.The solder joints form a continuous scallop shaped interface layer,and the thickness of the IMC layer meet the requirements of aerospace standards.

关 键 词：3D封装 BGA 控温 回流焊 仿真分析 

分 类 号：TN605[电子电信—电路与系统]