陶瓷外壳的实现  

Realization of a Highp-frequency CLGA Ceramic Shell Reachable up to 30 GHz

作　　者：王轲 乔志壮 刘林杰[1] 李明磊[1] 任赞[1] 左汉平 WANG Ke;QIAO Zhizhuang;LIU Linjie

机构地区：[1]中国电子科技集团公司第十三研究所,石家庄050051

出　　处：《科技创新与应用》2025年第12期7-10,共4页Technology Innovation and Application

摘　　要：该文提出一种可达30 GHz的通用陶瓷焊盘阵列外壳,其焊盘直径0.45 mm,节距0.80 mm。通过仿真优化球排布方式、射频端口尺寸,通过板级全模型仿真优化外壳整体布局。经板级实测射频端口在10MHz~30GHz的回波损耗不大于-15dB,插入损耗不大于-1.2dB,带内无谐振点,同时该外壳也通过可靠性验证。因此该外壳具有优异的高频特性和可靠性,可广泛应用于高频封装领域。This paper proposes a universal CLGA shell that can reach 30 GHz,with a pad diameter of 0.45 mm and a pitch of 0.80 mm.The ball arrangement and RF port size are optimized through simulation,and the overall layout of the housing is optimized through board-level full model simulation.According to board-level measurement,the RF port has S11≤-15 dB and S21≤-1.2 dB between 10 MHz and 30 GHz.There is no resonance point in the band.At the same time,the housing has also passed reliability verification.Therefore,the shell has excellent high-frequency characteristics and reliability,and can be widely used in the field of high-frequency packaging.

关 键 词：高频 CLGA BGA 陶瓷外壳 外壳设计 

分 类 号：TN405[电子电信—微电子学与固体电子学]