封装中的滚镀工艺研究  

Research of rolling electroplate in electronic packaging

作　　者：宁洪龙[1] 黄福祥[1] 马莒生[1] 耿志挺[1] 黄辉[1] 王永刚[1] 

机构地区：[1]清华大学材料系,北京100084

出　　处：《湘潭矿业学院学报》2002年第4期39-41,共3页Journal of Xiangtan Mining Institute

摘　　要：针对封装中的陶瓷外壳经常出现的电镀镀层不稳定的现象,通过滚镀工艺的阴极导通方式和面积加以改进,以改善电镀时镀件表面电流分布的均匀性,从面提高了滚镀的镀层质量.通过对比,发现影响镀层的关键性因素是与镀件连接的阴极,改进工艺后镀层的质量有明显的提高.图11,表1,参5.Roll plating of nickel and gold was investigated in this paper.Roll plating could improve the quality of the plating layer by the cathode conductivity and the conductivity area.The diameter of steel ball was the key factor in the roll plating process,it could even the surface current of the parts.The unsteadiness of normal electrlplating was solved by optimization of the influuencing parameters of roll plating.11figs.,1tab.,5refs.

关 键 词：封装 滚镀工艺 陶瓷外壳 电镀 技术改进 陶瓷金属化工艺 

分 类 号：TG174.453[金属学及工艺—金属表面处理]