复合球栅阵列CBGA封装器件热循环损伤的有限元模拟  

Finite Element Analysis of Thermal Induced Damage in Ceramic BGA Devices Featuring Composite Solder Array

作　　者：李勇[1] 汪荣昌[1] 顾之光[1] 戎瑞芬[1] 

机构地区：[1]复旦大学材料科学系,上海200433

出　　处：《复旦学报（自然科学版）》2003年第1期60-64,共5页Journal of Fudan University：Natural Science

基　　金：国家自然科学基金重点资助项目(69836030)

摘　　要：用粘塑性的本构方程描述62Sn36Pb2Ag和96.5Sn3.5Ag两种常用焊料的材料模式,使用通用有限元分析软件ANSYS模拟了CBGA(CeramicBallGridArray)封装器件焊球阵列应力应变的分布以及塑性功的积累;基于Darveaux等人提出来的塑性能量积累损伤方程,从热循环损伤的角度考察了焊点的可靠性;并对单一焊点阵列器件和复合焊点阵列封装器件的性能进行了比较.Anand viscoplastic constitutive model is used to describe the behavior of two types of eutectic BGA solder,i.e.62Sn36Pb2Ag and 96.5Sn3.5Ag,under thernal cycle loading. Thermal stress/strain and plastic energy accumulation process and distribution in the eutectic solder of CBGA device have been studied by FEM numerical calculation. Based on the results combined with the experimental fatigue lifetime prediction equation descibing inelastic demage accumulation mechanism given by Darveaux R.,solder fatigue cycles prediction and comparison have been conducted for series of samples with different solder joint array. Results show that better device reliability can be reached by properly combining different kinds of solder joint.

关 键 词：复合球栅阵列 CBGA 封装器件 热循环损伤 有限元模拟 

分 类 号：TN305.94[电子电信—物理电子学]