多芯片组件热分析技术研究  

Study on the Techniques of Thermal Analysis for Multi-chip Modules

作　　者：杨桂杰[1] 杨银堂[1] 李跃进[1] 

机构地区：[1]西安电子科技大学微电子研究所,西安710071

出　　处：《微电子学与计算机》2003年第7期78-80,共3页Microelectronics & Computer

摘　　要：多芯片组件(MCM)是实现电子系统小型化的重要手段之一。由于封装密度大、功耗高,MCM内部热场对器件的性能和可靠性的影响日益严重。文章讨论了MCM内部热场影响器件可靠性的机理,比较了MCM热场计算的方法和特点,研究了有限元分析的方法和求解过程,进行了实际计算,并提出了几种有效的降低MCM结温的方法。MCM is an important method of miniaturizing electronic systems.The affection of internal thermal field on the feature and reliability gets more and more serious.The failure mechanisms of MCM induced by thermal field are discussed in this paper.The comparison of principle and feature of several kinds thermal analysis methods is made.The basic idea and solve process of finite element method are mentioned with an example.At last,some effective methods of decreasing the temperature of MCM are brought forward.

关 键 词：单片集成电路 多芯片组件 热分析技术 可靠性 

分 类 号：TN43[电子电信—微电子学与固体电子学]