微电子封装技术对SMT的促进作用  

Promotion of SMT on Micro - electronic Packaging

作　　者：况延香[1] 朱颂春[1] 

机构地区：[1]中国电子科技集团公司第43研究所,安徽合肥230022

出　　处：《电子工艺技术》2004年第1期42-45,共4页Electronics Process Technology

摘　　要：SMD是SMT的三要素之一,并为SMT的基础;而微电子封装技术,特别是先进IC封装技术又是SMD的基础与核心,并深刻地影响着SMT其它要素——SMT设备和SMT工艺技术的发展与提高,从而推动SMT向更高层次发展。这一期重点论述微电子封装技术,特别是先进IC封装技术对SMT的挑战与推动。SMD is one of the three elements of SMT, and is a basis for SMT; while microelectronic packaging especially the advanced IC packaging serves as a basis and core of SMD, and has a profound impact on the other elements of SMT-SMT equipment and the development and promotion of SMT, which therefore pushes SMT forward to a higher level. Expound the microelectronic technology, in particular the challenge and promotion of SMT made by IC technology.

关 键 词：微电子封装 先进IC封装 SMD SMT 

分 类 号：TN405[电子电信—微电子学与固体电子学]