新型MEMS微致冷器可行性研究  

Feasibility of a New Micro-MEMS Cryogenic Refrigeratory

作　　者：李艳秋[1] 刘少波[1] 刘梅冬[2] 曾亦可[2] 

机构地区：[1]中国科学院电工研究所国家纳米中心,北京100080 [2]华中科技大学电子系,武汉430074

出　　处：《微细加工技术》2003年第4期51-56,共6页Microfabrication Technology

基　　金：中国科学院"引进国外杰出人才基金"2001年资助项目(20011215);国家863MEMS重大专项基金资助项目(2003AA404150)

摘　　要：MEMS的高能量密度驱动和IC高度集成使MEMS器件产生较强的热效应,影响了MEMS器件的稳定性和寿命。传统的致冷器与待致冷器件是相对独立的器件,无法满足MEMS器件局部有效致冷和系统集成的要求。介绍了一种新型铁电薄/厚膜MEMS微致冷器的原理和设计,探讨其作为MEMS致冷器的可行性,该致冷器可以在较大工作温度范围内,对基于IC硅工艺的MEMS器件和普通IC芯片进行致冷。The thermal effect of MEMS is a critical issue for its feasible application because high density power and IC chip are needed in MEMS. Traditional micro-cryogenic system is not practical in MEMS application as it apart from the elements of MEMS. It is not effective for local cooling and the integration of the system.The principles and design of a new micro-cryogenic system are presented and its feasibility is studied.The refrigerator has wide range of operating temperature and could be used for cooling the MEMS devices based on IC Si-processing technologies and general IC chips.

关 键 词：MEMS 微型致冷器 铁电薄膜 电热效应 Seeback效应 

分 类 号：TN384[电子电信—物理电子学]