一种新型无卤阻燃覆铜箔板基板材料的制备  

Studies on a novel non-halogen flame-retarding copper clad laminate

作　　者：凌鸿[1] 王劲[1] 向海[1] 盛兆碧[1] 顾宜[1] 

机构地区：[1]四川大学高分子科学与工程学院高分子材料工程国家重点实验室,四川成都610065

出　　处：《化学研究与应用》2004年第1期55-57,共3页Chemical Research and Application

摘　　要：以苯并嗪树脂与含磷环氧树脂作基体,外加磷酸酯类阻燃剂,KH平纹玻璃布作增强材料,制备了一种新型无卤阻燃覆铜板,其玻璃化转变温度为160℃,加强耐热性PCT(2p 水蒸气处理2h后,经288℃浸锡)试验达到385秒,径向弯曲强度为630 6MPa,阻燃性达到UL94V0级。A novel non-halogen flame retarding copper clad laminate was prepared with benzoxazine,phosphate,epoxy and glass cloth.It was proved that the copper clad laminate had excellent thermal stability as well as flame resistance.The copper clad laminate has Tg of 160℃,and flame retardancy reaches US standard of UL 94 V-0.By Pressure Cooking Test(it was dealt under 2 atm water vapor bath for 2 hours,then dipping in 288℃ tin bath and the heat-resistant time was tested),the heat-resistant time(288℃)of the copper clad laminate was 385 seconds.Its Flexure strength was 630.6 MPa.

关 键 词：无卤阻燃 覆铜箔板 基板材料 制备 苯并噁嗪树脂 含磷环氧树脂 

分 类 号：TN04[电子电信—物理电子学]