塑料芯片的红外激光加热键合研究  

Investigation of Infrared Laser Heating and Bonding of Plastics Chips

作　　者：赖建军[1] 陈西曲[1] 周宏[1] 易新建[1] 汪学方[2] 刘胜[2] 

机构地区：[1]华中科技大学光电子工程系,湖北武汉430074 [2]华中科技大学微系统中心,湖北武汉430074

出　　处：《红外技术》2004年第2期68-71,76,共5页Infrared Technology

基　　金：国家 8 63计划资助项目 (编号 :2 0 0 2AA40 40 70 )

摘　　要：阐述了利用红外激光与物质相互作用的热效应实现微系统器件的局部加热键合原理。研究了红外激光键合塑料芯片的实施条件和键合工艺过程 ,建立了半导体激光键合实验装置 ,并实现了有机玻璃芯片的激光键合。Plastics-based microsystem devices are now greatly investigated due to their low cost, biocompatibility and good processibility compared with silicon and/or glass based devices. Compared with their fabrication techniques, the bonding and packaging is a challenging issue for performing lost cost products. Conventional bonding and packaging methods have aroused problems like high temperature, high voltage, vibration damage or adhesive pollution. In this paper a method for plastics chips bonding was introduced by using infrared laser local heating. The bonding system was a diode laser heating system and had a minimal beam diameter of 50 microns. Nature and colored PMMA sheets were tested to demonstrate the weldability. Experimental results showed that among the colored polymer materials, those coated with carbon black ink had the best weldability.

关 键 词：塑料芯片 红外加热 键合工艺 半导体 有机玻璃芯片 激光键合 

分 类 号：TN405[电子电信—微电子学与固体电子学] TN2