陶瓷基板化学镀铜预处理的研究  

Research of Electroplating Cu on Pretreatment Ceramic Substrates

作　　者：宁洪龙[1] 耿志挺[1] 马莒生[1] 黄福祥[1] 钱志勇[1] 陈国海[1] 

机构地区：[1]清华大学,北京100084

出　　处：《稀有金属材料与工程》2004年第3期321-323,共3页Rare Metal Materials and Engineering

摘　　要：为提高封装基板铜导体层与陶瓷基板的结合强度,研究了在氧化铝和氮化铝的基板上进行化学镀铜,对表面进行粗化和改性,经过优化工艺条件后,氧化铝与镀层的结合强度可以达到27 MPa,氮化铝与镀层的结合强度可以达到22 MPa。Metallization is necessary for some packaging substrates. It is the key of metallization to improve the adhesion strength between copper plate and ceramic substrates. The adhesion between copper plate and ceramic substrates generally should be more than 15 MPa. Electroplated copper on alumina and aluminum nitride substrates has been studied. It is found that the roughening surface of the substrates can improve the adhesion. The technology of depositing copper plate and the testing methods of adhesion are also studied.

关 键 词：化学镀铜 陶瓷基板 结合强度 表面粗糙度 表面改性 氧化铝陶瓷 氮化铝陶瓷 

分 类 号：TN405[电子电信—微电子学与固体电子学]