金导电胶在晶体管管芯粘接上的应用  

The Applicatiod of Gold Conductive Adhesive to Bonding Transistor Chips

作　　者：杜红云[1] 郎彩[1] 

机构地区：[1]昆明贵金属研究所

出　　处：《中国胶粘剂》1992年第5期36-38,共3页China Adhesives

摘　　要：金导电胶是采用球形或近似球形,平均粒径为小于O.5μm的超细金粉,加入0.5%的锑粉以及热固性的树脂调合而成.文中主要介绍该导电胶在晶体管管芯粘接上的应用情况,并对有关性能进行了讨论.Gold conductive adhesive is composed of 0.5% antimony powder, thermosetting resin and super fine globe powder whose average diameter is lower than 0. 5μm. The paper mainly introduces the application of the adhesive to bonding transistor chips and its relative properties.

关 键 词：金粉 导电胶 粘接 晶体管 

分 类 号：TN304[电子电信—物理电子学]