Supported by the National Natural Science Foundation of China (51171068);the Vital Fund from Hubei Provincial Department of Education (C2010071);the Fund of the Vital Subject Program on Applied Chemistry in Hubei University of Education
With development of miniaturization,high integration,multifunction and high efficiency of electronic packaging technology,a higher requirement for soldering material and its enlistment property is needed.It is easily ...
Supported by the National Natural Science Foundation of China (NSFC)(51171068);the Vital Fund from Hubei Provincial Department of Education ( C2010071);the Fund of the Vital Subject Program on Applied Chemistry in Hubei University of Education
Electrochemical migration (ECM) characteristic is a new reliability failure. A parallel surfacial electrode system coupling with scanning electron microscope (SEM), energy dispersive X-ray analysis (EDAX), and X...