SOLDERING

作品数：51被引量：68H指数：5
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相关领域：金属学及工艺一般工业技术更多>>
相关作者：傅玉灿丁文锋杨长勇付建峰徐九华更多>>
相关机构：金蝶软件(中国)有限公司南京航空航天大学国电南瑞科技股份有限公司哈尔滨工业大学更多>>
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Tunable Reactive Wetting of Sn on Microporous Cu Layer被引量：1
《Journal of Materials Science & Technology》2012年第4期379-384,共6页Qingquan Lai Lei Zhang Cai Chen J.K.Shang 
supported by the National Natural Science Foundation of China (Grant No. 50501022);the National Basic Research Program of China (Grant No.2010CB631006)
Wetting of microporous Cu layer by liquid Sn resulted in contact angles from 0 to 33 deg., tunable by varying wetting temperature and porous microstructure. The wetting was dominated by the interracial metallurgical r...
关键词：WETTING Porous material SOLDERING 
Development of thermodynamic and kinetic databases in micro-soldering alloy systems and their applications被引量：1
《Progress in Natural Science:Materials International》2011年第2期97-110,共14页Ikuo OHNUMA Ryosuke KAINUMA Kiyohito ISHIDA 
Project(51031003) supported by the National Natural Science Foundation of China;Projects(2009DFA52170,2009AA03Z101) supported by the Ministry of Science and Technology of China;Project(200910024) supported by Fujian Provincial Department of Science and Technology:Proiect(3502Z20093001) supported by Xiamen City Department of Science and Technology
Recent progress in the development of thermodynamic and kinetic databases of micro-soldering alloys,which were constructed within the framework of the Thermo-Calc and DICTRA software,was presented.Especially,a thermod...
关键词：micro-soldering alloys THERMODYNAMICS KINETICS 
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