The existing studies, concerning the dressing process, focus on the major influence of the dressing conditions on the grinding response variables. However, the choice of the dressing conditions is often made, based on...
Low stress polishing is required for the manufacture of advanced integrated circuits(IC) with node sizes of 45 nm and smaller.However,the CMP community achieved the low stress by reducing the down force that press the...
Diamond pad conditioners can determine the efficiency of CMP processes and the quality of polished wafers.The polishing rate of a wafer is dependent on the amplitude(height) of pad asperities.The polishing uniformity ...
Diamond grits held in metal matrix(sintered or electroplated) are retained primary by mechanical locking.Because of this weak attachment,the pullouts of diamond from matrix are inevitable during the cutting process.Mo...