Project(2006AA03Z557) supported by The High-tech Research and Development Program of China;Project(2006CB605207) supported by the National Basic Research Program of China;Project(I2P407) supported by MOE Program For Changjiang Scholars and Innovative Research Team in University
Sessile drop technique was used to investigate the influence of Ti on the wetting behaviour of copper alloy on SiC substrate. A low contact angle of 15- for Cu alloy on SiC substrate is obtained at the temperature of ...