小批量铝碳化硅T/R组件封装外壳的研制  

The Research of a Small Amount AISiC Packaging Housing of T/R Module

作　　者：熊德赣[1] 刘希从[1] 堵永国[1] 杨盛良[1] 李益民[2] 唐荣[2] 

机构地区：[1]国防科技大学航天与材料工程学院,湖南长沙410073 [2]中南大学粉末冶金国家重点实验室,湖南长沙410083

出　　处：《电子与封装》2004年第4期29-32,共4页Electronics & Packaging

摘　　要：T/R组件是相控阵雷达的关键部件,对封装外壳材料提出了极高的要求。本文介绍了小批量T/R组件封装外壳研制中的关键技术,如近净成型预制件技术、真空气压浸渗技术和机械加工技术。T/R module is a key component in phased array radars and requires extremely high performance forpackaging housing materials with light weight, good thermal conductivity, and a low coefficient of thermalexpansion. Key technologys for a small amount AlSiC packaging hosing: of T/R module, such as near-netperform, vacuum gas pressure infiltration and machining, are introduced.

关 键 词：铝碳化硅复合材料 预制件 T/R组件 封装外壳 真空气压浸渗 

分 类 号：TN305.94[电子电信—物理电子学]