几种电子封装技术在便携式电子产品中的应用  

The Application of Several Electronic Packaging Technologies in Portable Electronics Products

作　　者：李桂云[1] 

机构地区：[1]中国电子科技集团公司第二研究所,山西太原市030024

出　　处：《电子工业专用设备》2004年第12期32-36,共5页Equipment for Electronic Products Manufacturing

摘　　要：简要阐述了便携式电子产品在制造中采用的几种封装技术,即;倒装芯片、MCM、WLP等,及对其利弊进行了分析,并对技术现状进行了简要说明。New technologies and processes has been put into the market as bamboo shoots after a spring rain with the widely application of portable electronics products. This paper briefly describes the several packaging technologies (including flip chip, MCM,WLP and so on) used in manufacturing of portable electronics products and analysis their advantageous and disadvantagous as well as mainly prescribes the states of the technologies.

关 键 词：电子封装 便携式电子产品 倒装芯片 多芯片模块 晶圆级封装 

分 类 号：TN305.94[电子电信—物理电子学]